About Us
Wisdom SemiTeC (Jiangsu) Technology Co., Ltd. (WSTC) is a high-tech enterprise at the forefront of 3D semiconductor integration, delivering technology solutions for next-generation IC manufacturing. The company specializes in the full spectrum of advanced bonding process technologies, offering state-of-the-art equipment including wafer-to-wafer (W2W) and die-to-wafer (D2W) Hybrid/Fusion Bonders, complemented by supporting systems for metrology, debonding, and other critical process steps.Backed by decades of experience in semiconductor equipment development, WSTC's core R&D team has established comprehensive in-house capabilities for end-to-end innovation in advanced bonding processes. Our solutions find applications in key areas such as front-end-of-line (FEOL) wafer manufacturing, advanced memory technologies, and advanced packaging. We provide robust technical support and customized solutions to meet the evolving demands of customers in the rapidly advancing field of 3D semiconductor integration.With a vision to become a global leader in advanced bonding technology, WSTC is committed to driving the long-term sustainability and technological self-reliance of China's semiconductor industry.
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2020R&D Launched
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ISO Class 5Cleanroom Classification
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100%In-house developed processes (%)
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60%R&D Employees (%)
Milestones
Our Culture
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VisionTo be the global leader in 3D integration technology
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MissionTo empower AI and fuel the future
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ValuesIntegrity, Simplicity, Science, Innovation
Honors