Based on forward design and independent development, WSTC CANOPUS Hybrid Bonder enables face-to-face connection of wafers with embedded metal pads. It has achieved world-leading levels in key performance indicators such as bonding strength and overlay accuracy. It supports multiple integrated modules including pre-alignment, real-time alignment, plasma activation, cleaning, metrology, and debonding.

Based on forward design and independent development, WSTC CANOPUS Fusion Bonder enables direct connection via dielectric layers of wafers. It has achieved world-leading levels in key performance indicators such as bonding strength and overlay accuracy. It supports multiple integrated modules including alignment, plasma activation, cleaning, inspection, and debonding.