Products
W2W Bonder
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W2W Hybrid BonderCANOPUS SeriesApplicationsCBA DRAM3D NAND / NORCISMicro-LED
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W2W Fusion BonderCANOPUS SeriesApplicationsLogic CFETLogic BSPDN4F2 DRAMCISSOI / POI
D2W Bonder
Auxiliary Equipment
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Overlay Metrology EquipmentGANYMEDE SeriesFeaturesCompatible with Transmission/Reflection ModesCompatible with W2W and D2W MetrologyWafer Full-Coverage Metrology (Full Map)Intelligent Recognition AlgorithmSuper-Resolution Imaging Algorithm
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Bonding Strength Inspection EquipmentTITAN SeriesFeaturesAuto / Semi-Auto OperationIR ImagingAuto AlignmentHigh-Precision Blade ControlLow Detection Error
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Void Inspection EquipmentMIRANDA SeriesFeaturesInfrared Imaging InspectionC-SAM OptionalHigh Inspection EfficiencyCustomizable Defect Size for Detection
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Debond EquipmentTRITON SeriesFeaturesMechanical DebondingLaser Debond OptionalHigh-Precision Blade ControlLow Chipping Rate
