Home | Products | W2W Bonder | W2W Fusion Bonder

W2W Fusion Bonder

CANOPUS Series

Based on forward design and independent development, WSTC CANOPUS Fusion Bonder enables direct connection via dielectric layers of wafers. It has achieved world-leading levels in key performance indicators such as bonding strength and overlay accuracy. It supports multiple integrated modules including alignment, plasma activation, cleaning, inspection, and debonding.

Operation

Fully-automatic
Wafer diameter

300mm
Alignment accuracy

High accuracy
Integrated module

Alignment, Activation, Cleaning, Defect Inspection and Debonding
Throughput

High throughput
Cleanliness control

ISO Class 1

Applications

Fusion bonding is a key process for achieving high-quality interface connection without the compromise of electrical and thermal properties of the materials involved. It finds applications in IC manufacturing at advanced nodes.