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W2W Hybrid Bonder

CANOPUS Series

Based on forward design and independent development, WSTC CANOPUS Hybrid Bonder enables face-to-face connection of wafers with embedded metal pads. It has achieved world-leading levels in key performance indicators such as bonding strength and overlay accuracy. It supports multiple integrated modules including pre-alignment, real-time alignment, plasma activation, cleaning, metrology, and debonding.

Operation

Fully-automatic
Wafer diameter

300mm
Alignment accuracy

High accuracy
Integrated module

Alignment and Metrology, Activation, Cleaning, Inspection, Debonding
Throughput

High throughput
Cleanliness control

ISO Class 1

Applications

Hybrid bonding is a core process of semiconductor manufacturing in the "More Moore" era. This equipment enables advanced 3D IC integration with enhanced interconnection density and performance.